The “ins” and “outs” of Surftape®
A sticky tape backing laminated to a punched plastic carrier tape framework of standard dimensions retains components in fixed positions for repeatable feeding to the assembly pick point. There is no cover tape to remove; even the smallest micro-size devices retain their original fixed positions in Surftape, ready for precision pick retrieval.
Using component taping machines with Die Bonder accuracy and repeatability enables “Blind Pick” component retrieval from Surftape for P & P assembling. This avoids the use of costly vision systems which slow the process and latest high speed, fine pitch assembly machines can run at “Full Throttle”. The Results? 30 percent gains in both throughputs and yields have been realized!
Component sellers gain major competitive advantages when their devices - - especially the MEMS sizes - - are packed in Surftape. Savvy assembly CM customers understand the Bonus Benefits obtainable when components are delivered to them in Surftape.
Original Surftape uses Nitto SWT10 Wafer Dicing Tape as the sticky tape backing material to which taped components are affixed. Feeders equipped with a ‘lift pin’ or ‘lift platform’ are needed to aid in picking devices from Surftape.
Two parallel rails of sticky tape, with designated spacing (i.e. gap) between rails, are laminated to the punched conductive plastic carrier tape. Devices are placed with their long axis centered across the gap between sticky tape rails. This arrangement provides clearance for the feeder ‘lift pin’, the action of which will be synchronized with the pick nozzle so that they rise in unison to release the device from its attachment to the sticky tapes The animation adjacent to this text illustrates the coordinated action of the pick tool and the lift pin to enable pick retrieval of the device.
For additional information regarding Surftape-enabled feeders for pick and place systems, contact your equipment manufacturer.
Surftape feeders, customized for many makes and models of Pick and place machines, may be viewed at www.delawaretechnologies.com
Using component taping machines with Die Bonder accuracy and repeatability enables “Blind Pick” component retrieval from Surftape for P & P assembling. This avoids the use of costly vision systems which slow the process and latest high speed, fine pitch assembly machines can run at “Full Throttle”. The Results? 30 percent gains in both throughputs and yields have been realized!
Component sellers gain major competitive advantages when their devices -
Original Surftape uses Nitto SWT10 Wafer Dicing Tape as the sticky tape backing material to which taped components are affixed. Feeders equipped with a ‘lift pin’ or ‘lift platform’ are needed to aid in picking devices from Surftape.
Two parallel rails of sticky tape, with designated spacing (i.e. gap) between rails, are laminated to the punched conductive plastic carrier tape. Devices are placed with their long axis centered across the gap between sticky tape rails. This arrangement provides clearance for the feeder ‘lift pin’, the action of which will be synchronized with the pick nozzle so that they rise in unison to release the device from its attachment to the sticky tapes The animation adjacent to this text illustrates the coordinated action of the pick tool and the lift pin to enable pick retrieval of the device.
For additional information regarding Surftape-
Surftape feeders, customized for many makes and models of Pick and place machines, may be viewed at www.delawaretechnologies.com
Surftape
Animation
Video courtesy of Delaware Technologies