Tempo Electronics, in conjunction with Bell Labs, the R&D group of Lucent Technologies, have developed and demonstrated a new process for flip-chip assembly using Surftape®. This combined with Surftape®'s conventional usage means you have the ultimate turn-key solution for your assembly process. You essentially get the best of both worlds; direct-chip-attach or chip-on-board, all from one tape and one feeder with no modifications.
For ‘Chip-on-board’ (COB)
Die Placements
Die Placements
For ‘Flip-chip’
Die Placements
Die Placements
Die on Surftape® are dispensed with active side facing UP.
A pushup tool in the Surftape® dispensing feeder lifts the chip from the sticky tape rails for transfer to the pick head on the assembly placement machine.
A pushup tool in the Surftape® dispensing feeder lifts the chip from the sticky tape rails for transfer to the pick head on the assembly placement machine.
Die on Surftape® are dispensed active side facing DOWN. This orientation is achieved by respooling and loading the Surftape® into the feeder UPSIDE DOWN.
A pushup tool in the SURFTAPE® dispensing feeder pushes the chip up BETWEEN the two rails of sticky tape for transfer to the pick head on the assembly placement machine.
A pushup tool in the SURFTAPE® dispensing feeder pushes the chip up BETWEEN the two rails of sticky tape for transfer to the pick head on the assembly placement machine.
Ani_two.mov goes here
Ani_one.mov goes here
COB placement and Flip-Chip