Bare Die and MEMS - singulated die and, especially MEMS devices, are fragile and must be protected from mechanical damage during shipping. Surftape holds the die in place without the edges or surface of the die being in contact with the packing material.

Flip-Chip - Tempo’s unique ‘push through technology’ enables bumped die and MLFs to be held FACE-UP in the tape during placement and transportation. This enables Inspection and Test IN TAPE.

Very thin die are difficult or impossible to transport in tape & reel. Not so with Surftape. Components with virtually no mass are held by the adhesive on the tape until released at the pick point. Die thickness down to 25um or less and sizes up to 15mm x 12mm can be accommodated as standard - no special tooling.

Very small components are no problem to Surftape - SMD 01005, small die (including Opto devices) and miniature MLFs.  Components are held in place by the adhesive until picked. These types of component are impossible to handle in conventional embossed tape (they don’t stay put) or punched carrier tape (once put in, they don’t come out)

Thin, lightweight mechanical components, such as weld-pads. The lack of mass causes no problem to Surftape.